1S-F12
Making the Impossible Possible with Laser Bonding
In collaboration with MEMS CORE, a MEMS development and manufacturing company, we have developed a laser bonding system capable of bonding wafer-to-wafer structures. The technology enables minimizing damage to device structures, low-temperature bonding, reduced outgassing, and the bonding of materials with significant CTE mismatches. These unique advantages make it possible to realize next-generation devices that were previously difficult or impossible to achieve with conventional bonding technologies.
Laser bonding offers several key advantages: minimizing damage to device structures, low-temperature wafer-level bonding, reduced outgassing, the ability to bond materials with large CTE mismatches such as quartz and silicon, and highly localized heating enabled by precise laser control.
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Corporate Strategy Division
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