1S-U09
SURTECH Plating Pavilion
The Challenge of Zero Particles!
Using our proprietary technology, we apply ultra-corrosion-resistant anodizing and anodizing that combines both corrosion resistance and heat resistance to key components of semiconductor manufacturing equipment. This minimizes particles to the greatest extent possible, helping our customers improve their yield rates.
It forms a dense layer approximately 1 μm thick on the surface of the coating. This dense layer acts as a cover that seals the pore surfaces, protecting the coating from etching gases and corrosive solutions inside semiconductor manufacturing equipment. In alkali resistance tests, it demonstrates five times the corrosion resistance of conventional coatings.
*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.
Apply for seminar
