We will showcase our glass microfabrication technologies, including Through-Glass Via (TGV) processing, which is expected to play an important role in next-generation semiconductor packaging and optical communications.
We will also exhibit SUGO-KURO, our black plating technology that achieves a reflectance of 1% or less in the visible-light spectrum. This surface treatment is effective for suppressing stray light and unwanted reflections in cameras, optical sensors, and analytical instruments.
Visitors will be able to view actual samples and discuss solutions tailored to their specific applications and technical challenges. We look forward to welcoming you to our booth.
By combining laser modification with etching, we create fine, high-aspect-ratio through-holes (TGVs) in glass substrates. Our technology supports minimum hole diameters of 20 µm, aspect ratios of up to 1:10, sidewall roughness of Ra 0.08 µm or less, and glass thicknesses ranging from 0.1 to 1.0 mm. We also provide an integrated process from sputtered seed-layer formation to copper plating, including conformal plating along the via walls and complete via filling.
SUGO-KURO is a low-reflectance black plating technology that achieves a reflectance of 1% or less across the visible-light spectrum (380–750 nm).
It suppresses unwanted reflections (stray light) from substrate surfaces, helping improve the optical performance of cameras, projectors, optical sensors, analytical instruments, and other optical equipment.
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