4S-U08
Thermal Solution Area
【Theme: Designing Thermal Management with Advanced Ceramics】
Ceramic heaters for heating, and ceramic packages/substrates for heat dissipation. We present ceramic thermal solutions that address your device challenges from both heat generation and dissipation perspectives.
As semiconductors and electronic devices become increasingly integrated and powered, managing heat has become a critical challenge.
At our booth, we showcase a range of ceramic packages and substrates designed specifically for efficient heat dissipation from IC chips and heat-generating components. From high-thermal-conductivity material selection and highly flexible 3D structural design to thermal simulation analysis, we deliver tailored thermal solutions optimized for your products.
Achieving localized and rapid heating is critical for industrial equipment and heating devices that demand compact design and high output.
At our booth, we showcase a range of ceramic heaters focused specifically on precision heat generation. From rapid temperature-ramp materials (silicon nitride reaching 1,000°C in approx. 2 seconds) and versatile structural design to integrated temperature sensor printing, we deliver tailored heating solutions optimized for your applications.
*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.
Apply for seminar
