Techpolymer can provide a wide range of functionalities when incorporated into adhesives and pressure-sensitive adhesives, including viscosity control, bond-line thickness control, toughness and flexibility enhancement, dielectric constant reduction, and optical property adjustment.

Recommended Grades

• Tack Control: MBX Series (Food-contact compliant grades available)
• Appearance Control: MSX Series
• Bond-Line Thickness Control: SSX Series
• Viscosity Control: Non-Crosslinked Particle Series
• Toughness Enhancement: Soft Particle Series

For more information and customized solutions, please contact our sales representative.

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Techpolymer particles exhibit thermal decomposition characteristics. During the firing process of ceramic or metal powders, the particles burn out completely, creating uniform spherical pores and interconnected pore structures.

＜Pore Formers＞
Burn out during firing
Generate uniform spherical pores
Create interconnected porous structures
Suitable for ceramics and metal powder processing

＜Binders＞
Solvent-soluble non-crosslinked grades
Excellent binder performance
Clean decomposition during debinding
IBM-3 leaves minimal residue under non-oxidizing atmospheres


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Techpolymer microparticles can be used as additives in compounds for cosmetic bottles, as well as in coatings and inks for food packaging and other applications. They provide a variety of functional benefits, including enhanced appearance, improved tactile feel, and anti-blocking performance.

Key Features

Compliant with food contact regulations in various countries
Wide product lineup available in different particle sizes and softness levels
Matte finishing and appearance enhancement
Improved scratch and abrasion resistance
Surface texturing and anti-blocking performance (AB additive)

For further information, please contact our sales team:
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Techpolymer develops advanced materials for semiconductor packaging and assembly applications to reduce signal loss in high-frequency 5G communications.

Front-End Processes

Hollow nanoparticles enable ultra-low refractive index materials (<1.4) for advanced photolithography and microfabrication.

Back-End Processes

Submicron to micron-sized polymer particles provide low dielectric properties through tailored resin compositions and hollow structures.

Key Benefits

Low Refractive Index
Low Dielectric Constant
Customizable Particle Design

For more information, please contact us:

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Adding "TECHPOLYMER" in extruded films or in coatings on the surface of films can provide the films with anti-blocking effects by the uneven surface created on the film. Compared to inorganic materials (such as silica), "TECHPOLYMER" has high chemical affinity with the base resins, and can help prevent damage on the surface of the film while reducing loss of the anti-blocking agent. In addition, for applications which require high transparency, "TECHPOLYMER" offers solutions from various refractive index and sizes.

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The softness can be adjusted by changing the resin composition. The scratch resistance of the surface is improved by abrasion absorbed effectively from the balance of the softness and recoverability of the particles. Able to propose grades that is suitable for your requirements from the lineup of four soft particle series.

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Techpolymer NF Series consists of monodisperse nano- to submicron-sized polymer particles with a narrow particle size distribution.

Features
Precise particle size control (100–1,500 nm)
Adjustable refractive index (1.49–1.59)
Customizable particle design to meet specific requirements
Potential Applications
Fine and uniform surface texturing for coatings and compounds
Slip and anti-blocking additives for films
Pore-forming agents for porous structures and lightweight materials
Low-dielectric additives for semiconductor materials

Now under development:
Sub-100 nm particles with tunable refractive index properties

For more information, please contact us:
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Techpolymer NH Series consists of nano-sized hollow polymer particles that provide low refractive index, low reflectivity, and low dielectric properties through their internal air void structure.

Features

Narrow particle size distribution with controllable particle size
Tunable hollow ratio for low density, low refractive index, and low dielectric performance
Surface functionalization available

Applications

Low refractive index coatings
Low dielectric materials
Photolithography and micro-optical fabrication
Semiconductor encapsulation materials

https://www.tech-p.com/en/inquiries/

Hydrophilic Particles

TECHPOLYMER hydrophilic particles are surface-modified with hydrophilic functional groups, providing excellent dispersibility in water and highly polar solvents. As a result, they improve handling and processing performance when incorporated into water-based paints and inks.

Features

High hydrophilicity improves dispersion in water-based coatings and inks, as well as in systems using highly polar solvents.
In addition to precise control of particle size and particle size distribution, functional properties such as softness and solvent resistance can be tailored to meet application requirements.

For more information, please contact us.
https://www.tech-p.com/en/inquiries/