Product / Technology Information
Booth Presentation
Ultraviolet light with a wavelength of 172 nm is irradiated onto semiconductor chips, substrate insulating materials, glass, and other substrates to activate the surface (oxidation and reduction) and clean it (removing organic matter). This improves the adhesion of copper plating to insulating materials and enables hybrid bonding.
Product/Technology Category
Processing Technology
Mounting/Circuit Formation Technologies (Solder Mounting, 3D-MID, Printed Circuit Board-Related)
Plating/Surface Treatment Technology
Other Converting Technology
：
（Japanese）酸化洗浄・金属還元（English）Oxidative cleaning and Metal reduction
Processing Equipment
Surface Modification/Surface Functionalization
Purpose of use
Batteries (Perovskite Solar Cells/Lithium-ion Batterie/All-Solid Batteries, etc.)
Semiconductors
Application Field
Organic Material / Chemical
Semiconductor / Electrical Equipment & Component
Precision Equipment / Industrial Machinery / Robotics
Automobile / Logistics / Transporting
Medical Device
Electronics / Home Appliance
Printing / Converting / Contracted Services
Surface Treatment
Construction / Real estate
Solutions
Next generation communication
Next generation battery
Contact
*The following information is provided to enable inquiries to exhibitors.
Unauthorized use and reproduction for any other purpose is prohibited.
Exhibitor Name
Ushio
Address
1194, Sazuchi Bessho-cho, Himeji, Hyogo, Japan 6710224
TEL
079-252-4381
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