• 2026/12/16 12:30 ~ 13:45
    Venue：Main Theater (South hall 3)
    nano tech executive committee/JTB Communication Design
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    【nano tech Special Symposium】 Core Technologies of Optoelectronic Integration Packages
    - Implementation, Materials, and Light Source Technologies That Bring Together Japan’s Strengths -
    Pre-Registration required
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    session
    12:30 ~ 12:55
    Packaging and Evaluation Technologies for High-Density CPO Using Polymer Optical Waveguides
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    Dr. Suda Satoshi
    National Institute of Advanced Industrial Science and Technology
    Photonics-Electronics Integration Research Center
    Team Leader
    【Profile】

    Satoshi Suda received his Ph.D. from the Tokyo Institute of Technology in 2008 and subsequently worked as a Visiting Researcher at the University of California, Berkeley. He has been engaged in research and development of silicon photonics, polymer optical waveguides, and optoelectronic packaging technologies at the National Institute of Advanced Industrial Science and Technology (AIST) and the Photonics Electronics Technology Research Association (PETRA). He is currently Team Leader at the Optoelectronics Convergence Research Center, AIST, where he leads research on package substrate technologies for optoelectronic convergence and international standardization activities in the IOWN Global Forum.

    12:55 ~ 13:20
    Development of Advanced Resin Materials for Next-Generation Optoelectronic Packaging
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    Mr. Masahiro Karakawa
    Ajinomoto Co., Inc.
    13:20 ~ 13:45
    Latest Advances in High-Power Semiconductor Laser Sources for Photonic-Electronic Integrated Packages
    【Abstract】

    With AI and machine-learning services spreading, data centers need higher bandwidth between and within servers. Photonic-electronic integration, which places optical transceivers near electrical signal processors, is attracting attention. It includes Near-packaged Optics (NPO), with optical components near the package, and Co-packaged Optics (CPO), with electrical processors and optical components densely integrated in one package. Shorter wiring and lower loss enable high-capacity, high-speed communication. However, laser sources essential to optical communication are hard to integrate in photonic-electronic packages
    because high temperatures make it difficult to maintain performance and reliability. Thus, external laser sources are commonly kept in stable thermal environments and supplied through optical fibers. This presentation reviews their required performance and
    introduces recent technologies and trends in semiconductor laser sources for high-density integration.

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    Dr. Inoue Daisuke
    Sumitomo Electric Industries,Ltd.
    Sumitomo Electric Device Innovations Inc.
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