The rapid growth of artificial intelligence (AI) and high-performance computing (HPC) is driving demand for higher performance, greater memory capacity, and lower power consumption in semiconductor systems. Advanced packaging technologies, including chiplet integration and 2.5D/3D integration, are becoming increasingly important. However, these technologies face challenges in fine-pitch interconnections, signal and power integrity, thermal management, mechanical stress caused by thermal expansion mismatch, and long-term reliability. This presentation reviews recent trends and key challenges in advanced semiconductor packaging, including RDL-based and glass interposers. It also discusses the requirements for insulating resins, adhesive and encapsulation materials, thermal management materials, and other advanced materials essential for next-generation semiconductor packaging.