• 2026/12/17 14:45 ~ 15:25
    Venue:SURTECH Seminar(South hall 1)
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    SURTECH organizers seminar
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    14:45 ~ 15:25
    Advanced Semiconductor Packaging Technologies for the AI Era
    The Frontiers of Chiplets, 3D Integration, and Hybrid Bonding
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    Prof. Fumihiro Inoue
    Yokohama National University
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